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| AOD419 P-Channel Enhancement Mode Field Effect Transistor General Description The AOD419 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications. Standard Product AOD419 is Pb-free (meets ROHS & Sony 259 specifications). AOD419L is a Green Product ordering option. AOD419 and AOD419L are electrically identical. TO-252 D-PAK D Top View Drain Connected to Tab G S G D S Features VDS (V) = -40V (V GS = -10V) ID = -20A RDS(ON) < 40m (VGS = -10V) RDS(ON) < 65m (VGS = -4.5V) Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage Continuous Drain Current B,G Pulsed Drain Current C Avalanche Current Repetitive avalanche energy L=0.3mH TC=25C Power Dissipation B C Maximum -40 20 -20 -18 -60 -20 60 50 25 2.5 1.6 -55 to 175 Units V V A A mJ W W C TA=25C G TA=100C ID IDM IAR EAR PD PDSM TJ, TSTG TC=100C TA=25C TA=70C Power Dissipation A Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A Maximum Junction-to-Case C Symbol t 10s Steady-State Steady-State RJA RJL Typ 16.7 40 2.5 Max 25 50 3 Units C/W C/W C/W Alpha & Omega Semiconductor, Ltd. AOD419 Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter Conditions ID=-10mA, VGS=0V VDS=-32V, VGS=0V TJ=55C VDS=0V, VGS=20V VDS=VGS ID=-250A VGS=-10V, VDS=-5V VGS=-10V, ID=-20A RDS(ON) gFS VSD IS Static Drain-Source On-Resistance VGS=-4.5V, ID=-5A Forward Transconductance VDS=-5V, ID=-20A IS=-1A,VGS=0V Diode Forward Voltage Maximum Body-Diode Continuous Current TJ=125C -1 -60 33 45 52 16 -0.75 -1 -20 657 VGS=0V, VDS=-20V, f=1MHz VGS=0V, VDS=0V, f=1MHz 143 63 6.5 14.1 VGS=-10V, VDS=-20V, ID=-20A 7 2.2 4.1 8 VGS=-10V, VDS=-20V, RL=1, RGEN=3 IF=-20A, dI/dt=100A/s 12.2 24 12.5 23.2 18.2 850 185 90 40 54 65 -2.2 Min -40 -1 -5 100 -3 Typ Max Units V A nA V A m m S V A pF pF pF nC nC nC nC ns ns ns ns ns nC STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS IGSS VGS(th) ID(ON) Zero Gate Voltage Drain Current Gate-Body leakage current Gate Threshold Voltage On state drain current DYNAMIC PARAMETERS Ciss Input Capacitance Coss Crss Rg Output Capacitance Reverse Transfer Capacitance Gate resistance SWITCHING PARAMETERS Qg(10V) Total Gate Charge (10V) Qg(4.5V) Total Gate Charge (4.5V) Qgs Qgd tD(on) tr tD(off) tf trr Qrr Gate Source Charge Gate Drain Charge Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=-20A, dI/dt=100A/s A: The value of R JA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25C. The Power dissipation PDSM is based on R JA and the maximum allowed junction temperature of 150C. The value in any given application depends on the user's specific board design, and the maximum temperature of 175C may be used if the PCB allows it. B. The power dissipation PD is based on TJ(MAX)=175C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175C. D. The R JA is the sum of the thermal impedence from junction to case R JC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175C. G. The maximum current rating is limited by bond-wires. H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The SOA curve provides a single pulse rating. Rev 0: Aug. 2006 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Alpha & Omega Semiconductor, Ltd. AOD419 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 60 50 40 -ID (A) 15 30 20 10 0 0 1 2 3 4 5 -VDS (Volts) Figure 1: On-Region Characteristics 90 Normalized On-Resistance 80 70 RDS(ON) (m) 60 50 40 30 20 0 5 10 15 20 25 30 -ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage 100 ID=-20A 80 RDS(ON) (m) 1.0E+02 1.0E+01 1.0E+00 1.0E-01 60 125C -IS (A) 1.0E-02 1.0E-03 40 25C 20 3 4 5 6 7 8 9 10 -VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage 1.0E-04 1.0E-05 1.0E-06 0.0 0.2 0.4 0.6 0.8 1.0 -VSD (Volts) Figure 6: Body-Diode Characteristics 25 125C VGS=-10V VGS=-4.5V 1.80 1.60 1.40 1.20 1.00 0.80 0 25 50 75 100 125 150 175 Temperature (C) Figure 4: On-Resistance vs. Junction Temperature VGS=-10V ID=-20A -4.5V -ID(A) -10V 25 VDS=-5V 20 ID=-10mA, -6V =0V VGS 10 125C VGS=-3.5V 5 25C 0 1 1.5 2 2.5 3 3.5 4 4.5 5 -VGS(Volts) Figure 2: Transfer Characteristics 850 185 90 VGS=-4.5V ID=-5A Alpha & Omega Semiconductor, Ltd. AOD419 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 VDS=-15V ID=-20A 1000 8 -VGS (Volts) ID=-10mA, VGS=0V Capacitance (pF) 750 Ciss 6 500 Coss 250 Crss 4 2 0 0 3 6 9 12 15 0 10 20 30 40 -VDS (Volts) Figure 8: Capacitance Characteristics 0 -Qg (nC) Figure 7: Gate-Charge Characteristics 100.0 10s RDS(ON) limited 10ms 1.0 TJ(Max)=175C, TC=25C 0.1 0.1 1 -VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) 10 100 DC 200 160 850 185 90 TJ(Max)=175C TC=25C -ID (Amps) 10.0 100s Power (W) 1ms 120 80 40 0 0.0001 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toCase (Note F) 10 ZJA Normalized Transient Thermal Resistance D=Ton/T TJ,PK=Tc+PDM.ZJC.RJC RJC=3C/W 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD Ton Single Pulse 0.01 0.00001 T 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Alpha & Omega Semiconductor, Ltd. AOD419 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 25 -ID(A), Peak Avalanche Current 20 15 10 5 0 0.00001 TA=25C 60 Power Dissipation (W) ID=-10mA, VGS=0V 50 40 30 20 10 0 0.0001 0.001 0 25 50 75 100 125 150 175 Time in avalanche, t A (s) Figure 12: Single Pulse Avalanche capability TCASE (C) Figure 13: Power De-rating (Note B) 25 20 15 10 5 0 0 25 50 75 100 125 150 175 TCASE (C) Figure 14: Current De-rating (Note B) Power (W) 60 50 40 30 20 10 0 0.001 850 185 90 TA=25C Current rating -ID(A) 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 15: Single Pulse Power Rating Junction-toAmbient (Note H) 10 ZJA Normalized Transient Thermal Resistance 1 D=Ton/T TJ,PK=TA+PDM.ZJA.RJA RJA=50C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD Single Pulse Ton 0.01 T 100 1000 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance (Note H) Alpha & Omega Semiconductor, Ltd. |
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